Call For Papers

The topics of interest for submission include, but are not limited to:

◕ Advanced Semiconductor Devices

· New Semiconductor Materials and Their Applications in Devices

· High-Performance MOSFET Design and Optimization

· Power Device Technologies for Energy Efficiency Optimization

· III-V Compound Semiconductor Devices Beyond Silicon

· Micro-Optoelectronic Semiconductor Sensors and Their Applications

· Semiconductor Lasers and Their Emerging Application Areas

· Graphene and Other Two-Dimensional Material Devices

· Quantum Dot and Quantum Well Semiconductor Devices

· Novel Memory Devices: RRAM, MRAM, FeRAM

· Challenges and Opportunities in Low-Temperature Electronic Devices

· Breakthrough Technologies for High-Frequency and High-Power Devices

· Silicon-Based Optoelectronic Devices and Their Integration Technologies

· Research on Tunnel Field-Effect Transistor (TFET) Devices

· Reliability and Aging Mechanisms of Semiconductor Devices

· Impact of Advanced Packaging and Interconnection Structures on Device Performance

◕ Integration Technology

· Three-Dimensional Integrated Circuits and Their Manufacturing Processes

· System on Chip (SoC) and Integration Methods

· Chip Heterogeneous Integration Technology

· Development and Innovation in Package-Level Integration Technologies

· Thermal Management Technologies in Integrated Circuits

· Radio Frequency Integrated Circuits and Their Design Optimization

· Applications of Artificial Intelligence and Machine Learning in Integrated Circuit Design

· Advanced Analog and Mixed-Signal Integrated Circuits

· Power Management Integrated Circuit Technologies

· Reliability and Security Challenges in Integrated Circuit Design

· Silicon Photonics Interconnection Technologies

· The Latest Advances in Ultra-Large-Scale Integration Technologies

· Emerging Memory Integration Technologies

· Modular MEMS and NEMS Integration Applications

· Integration and Innovation in Intelligent Sensing Systems