The topics of interest for submission include, but are not limited to:
◕ Advanced Semiconductor Devices
· New Semiconductor Materials and Their Applications in Devices
· High-Performance MOSFET Design and Optimization
· Power Device Technologies for Energy Efficiency Optimization
· III-V Compound Semiconductor Devices Beyond Silicon
· Micro-Optoelectronic Semiconductor Sensors and Their Applications
· Semiconductor Lasers and Their Emerging Application Areas
· Graphene and Other Two-Dimensional Material Devices
· Quantum Dot and Quantum Well Semiconductor Devices
· Novel Memory Devices: RRAM, MRAM, FeRAM
· Challenges and Opportunities in Low-Temperature Electronic Devices
· Breakthrough Technologies for High-Frequency and High-Power Devices
· Silicon-Based Optoelectronic Devices and Their Integration Technologies
· Research on Tunnel Field-Effect Transistor (TFET) Devices
· Reliability and Aging Mechanisms of Semiconductor Devices
· Impact of Advanced Packaging and Interconnection Structures on Device Performance
◕ Integration Technology
· Three-Dimensional Integrated Circuits and Their Manufacturing Processes
· System on Chip (SoC) and Integration Methods
· Chip Heterogeneous Integration Technology
· Development and Innovation in Package-Level Integration Technologies
· Thermal Management Technologies in Integrated Circuits
· Radio Frequency Integrated Circuits and Their Design Optimization
· Applications of Artificial Intelligence and Machine Learning in Integrated Circuit Design
· Advanced Analog and Mixed-Signal Integrated Circuits
· Power Management Integrated Circuit Technologies
· Reliability and Security Challenges in Integrated Circuit Design
· Silicon Photonics Interconnection Technologies
· The Latest Advances in Ultra-Large-Scale Integration Technologies
· Emerging Memory Integration Technologies
· Modular MEMS and NEMS Integration Applications
· Integration and Innovation in Intelligent Sensing Systems