2025 International Symposium on Advanced Semiconductor Devices and Integration Technology
Call For Papers
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Call For Papers

Manuscripts passed the peer-review process by expert reviewers from the conference organizing committee will be accepted and published in the Conference Proceedings. The published papers will then be submitted to EI Compendex, Scopus for abstracting/indexing. 

The topics of interest for submission include, but are not limited to:

◕ Advanced Semiconductor Devices

· New Semiconductor Materials and Their Applications in Devices

· High-Performance MOSFET Design and Optimization

· Power Device Technologies for Energy Efficiency Optimization

· III-V Compound Semiconductor Devices Beyond Silicon

· Micro-Optoelectronic Semiconductor Sensors and Their Applications

· Semiconductor Lasers and Their Emerging Application Areas

· Graphene and Other Two-Dimensional Material Devices

· Quantum Dot and Quantum Well Semiconductor Devices

· Novel Memory Devices: RRAM, MRAM, FeRAM

· Challenges and Opportunities in Low-Temperature Electronic Devices

· Breakthrough Technologies for High-Frequency and High-Power Devices

· Silicon-Based Optoelectronic Devices and Their Integration Technologies

· Research on Tunnel Field-Effect Transistor (TFET) Devices

· Reliability and Aging Mechanisms of Semiconductor Devices

· Impact of Advanced Packaging and Interconnection Structures on Device Performance

· ......

◕ Integration Technology

· Three-Dimensional Integrated Circuits and Their Manufacturing Processes

· System on Chip (SoC) and Integration Methods

· Chip Heterogeneous Integration Technology

· Development and Innovation in Package-Level Integration Technologies

· Thermal Management Technologies in Integrated Circuits

· Radio Frequency Integrated Circuits and Their Design Optimization

· Applications of Artificial Intelligence and Machine Learning in Integrated Circuit Design

· Advanced Analog and Mixed-Signal Integrated Circuits

· Power Management Integrated Circuit Technologies

· Reliability and Security Challenges in Integrated Circuit Design

· Silicon Photonics Interconnection Technologies

· The Latest Advances in Ultra-Large-Scale Integration Technologies

· Emerging Memory Integration Technologies

· Modular MEMS and NEMS Integration Applications

· Integration and Innovation in Intelligent Sensing Systems

· ......